CM800 IBL Vapor Phase Reflow Soldering Machines

englisch

Vapour Phase Machines

PREMIUM | CX800 / CX600


CM800 IBL Vapor Phase Reflow Soldering Machines
Mr Big

  • Highest precision and process quality with patented Soft Vapour Phase (SVP) Technology
  • Maximum throughput in Double Soft Vapour Inline operation
  • Board Sizes up to 800 x 650 x 80 mm
  • Low energy and fluid consumption with 3-chamber design and integrated heat exchanger
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Small footprint
  • Easy operation due to soldering automatic and patented process
  • Easy touch screen control
  • Patented IR preheating ideal also for glue hardening and for additional performance

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