ReSy is a fast and economic tool
for the re-work of assemblies (such as BGAs and QFBs).
Components can be easily and gently removed using the ReSy.
The rework system is attached to the board and the component, then the
assembly is set into the vapour phase system using a rework setup.
The secret of this patented system is the temperature controlled lift
of the components. This ensures that the component can be lifted of
without force and thus without damaging board or component.
The gentleness of this process is best seen by the fact that even
re-balling is often not required.
